摘要
铜-银复合粉末具有良好的抗氧化性、热稳定性及高电导性,在电子浆料、导电填料等众多领域具有广阔的应用前景.利用化学镀的方法,采用氯化亚锡为敏化剂,甲醛为还原剂,合成了用于电子浆料的铜-银复合粉末.用X射线衍射、扫描电镜表征了复合粒子的晶型和形貌结构,研究了敏化剂氯化亚锡、反应温度、还原剂及镀液的pH值对材料晶型和形貌的影响.结果表明:采用甲醛为还原剂,经过敏化处理后,当镀液pH值为10时,在50℃下,合成的银包铜粉电接触材料有较好的形貌.
Silver coated copper powders has a wide application in the electronic paste,conductive filler,and other fields because of its good oxidation resistance,thermal stability and high conductivity.Silvercopper composite powders were synthesized by chemical plating method in which the stannous chloride and formaldehyde were used as sensitizer and reducing agent,respectively.X-ray diffraction and scanning electron microscopy were used to characterize the morphology and crystalline structure of the composite particles.The effects of sensitizer stannous chloride,reaction temperature,reducing agent and pH value of solution on the surface and crystal morphologies of the composite particles were investigated.The results show that using formaldehyde as a reducing agent with the post-treatment of sensitization,the silver-plated copper powders with well morphology can be obtained when the pH value of solution is 10 and the reaction temperature is kept around 50 ℃.
出处
《武汉工程大学学报》
CAS
2013年第11期37-42,共6页
Journal of Wuhan Institute of Technology
基金
湖北省自然科学基金(2011CBD220)
2013武汉工程大学研究生创新基金项目(CX201237)
关键词
银-铜复合粉
敏化
还原
化学镀银
微米颗粒
silver-copper composite powder
sensitized
deoxidization
electro-less silver plating
micros-particles
