摘要
通过共价自组装方法将硫普罗宁修饰在金电极表面形成单分子膜,通过配位键富集Cu2+后,用十二烷基硫醇封闭电极表面"针孔",然后移去Cu2+,从而制成对Cu2+有印迹效应的修饰电极。应用循环伏安法、交流阻抗法和差分脉冲伏安法研究了单分子膜的形成、自组装时间、修饰电极对Cu2+的电化学响应及其选择性。结果表明,硫普罗宁能够自组装在金电极表面形成单分子膜并对Cu2+具有良好的富集作用;修饰电极对Cu2+具有印迹效应,选择性较好;Cu2+浓度在0.01~1.0μmol·L-1范围内与其峰电流存在线性关系(r=0.999),检测限为0.005μmol·L-1。响应电流测定的相对标准偏差为5.6%。
The gold electrode surface was modified by tiopronin to form the self-assembled monolayers using the covalent self-assembly methods. The modified electrode with imprinting effect was prepared according to the following steps, firstly, Cu2＋ was accumulated on the modified electrode surface by coordination adsorption,then the pinhole on the modified electrode surface was filled with dodecanethiol and Cu2＋ was removed from the modified electrode surface lastly. The formation of the monolayer, the self-assembly time,the electrochemical response for Cu2＋ and the selectivity of the modified electrode were studied by cyclic voltammetry, AC impedance techniques and differential pulse voltammetry. The results show that tiopronin can be self-assembled on the gold electrode surface and has a good enrichment for Cu2＋. The modified electrode has the apparent imprinting effect, a good selectivity and a high sensitivity for Cu2＋. The response current was linear with Cu2＋ concentration over a range from 0.01 μmol. L-1 to 1.0 μmol. I.-1 （r=0. 999）with a detection limit of 0. 005 μmol＂ L-1. The relative standard deviation for the response current measurement was 5.6 %.
出处
《分析科学学报》
CAS
CSCD
北大核心
2013年第6期773-776,共4页
Journal of Analytical Science
关键词
硫普罗宁
自组装单分子膜
金电极
铜离子
Tiopronin Self-assembled monolayers Gold electrode Cupric ion
