摘要
采用阴极移动电镀法在不同电流密度下制备镍镀层。镀液组成和工艺条件为：NiSO4．6H2O260～280g／L，NiCl2.6H2O 40～50g／L，H3BO3 40g／L，阴极移动速率12m／min，电流密度1～7A／dm2，pH4．0～4．4，时间30min，室温。对比研究了阴极静置和移动时所得镍镀层的表面形貌、粗糙度、孔隙率、组织结构以及显微硬度等性能。结果表明，电流密度为1～4A／dm2时，阴极移动对镀层性能的影响不显著；电流密度为7A／dm2时，阴极移动可有效降低浓差极化，使镍镀层孔隙率和残余应力分别降低约50．0％和14．6％，镀层显微硬度达330HV（提高了10％），粗糙度约为0．7μm左右，但镀层的择优取向仍以（200）晶面为主。
Ni coatings were prepared electroplating with moving cathode at different current densities. The bath composition and process parameters are as follows： NiSO4.6H2O 260-280 g/L, NiCl2.6H2O 40-50 g/L, H3BO3 40 g/L, room temperature, cathode moving rate 12 m/min, current density 1-7 A/dm2, pH 4.0-4.4, and time 30 min. The surface morphology, roughness, porosity, microstructure, and microhardness of Ni coatings obtained with unmoving and moving cathode were comparatively studied. The results show that cathode movement has no significant effect on the properties of nickel coating at current density of 1-4 A/dm2. At the current density of 7 A/dm2, cathode movement can effectively weaken concentration polarization, making the porosity and residual stress of nickel coating reduced by 50.0% and 14.6% respectively. The Ni coating obtained withcathode movement at 7 A/dm2 features a microhardness 330 HV （10% higher than that prepared with unmoving cathode）, roughness ca.0.7 μm, and （200）-preferred orientation.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2013年第10期5-9,共5页
Electroplating & Finishing
基金
国家自然科学基金(51005244)
武器装备预研基金重点项目(9140C850201110C8501)
国家973课题(2011CB013403)
关键词
电镀镍
阴极移动
电流密度
组织结构
性能
nickel electroplating
cathode movement
current density
microstructure
property
