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氮化铜薄膜制备中氮气比例对其结构及微观力学性能的影响 被引量:3

Effect of Nitrogen Partial Pressure on the Structure and Micro-mechanical Properties of Cu_3 N Films
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摘要 采用射频磁控溅射方法在玻璃基底上制备氮化铜薄膜,研究了氮氩混合气体中的氮气比例对薄膜择优生长取向、表面晶粒尺寸和微观力学性能的影响。结果表明:低氮气比例时,薄膜的纳米力学性能比较差;随着氮气比例的增加,氮化铜薄膜的择优生长晶面从(111)晶面转变为(100)晶面,晶粒尺寸变小,显微硬度增加,弹性模量则是先增加,后减小。 Copper nitride thin films were prepared on silicon glass substrates by means of RF magnetron sputtering dep- osition, and then the effects of nitrogen partial pressure in a fixed-total Na-Ar mixture sputtering gas flow on the preferential crystalline orientation, the size of surface grain and micro-mechanical properties were investigated. It is showed that when the nitrogen partial pressure is low, the nano-mechanieal property of the thin film is poor. As nitrogen partial pressure improves the preferential orientation transforms from plane (111 ) to plane (100) , the crystalline grain size shrinks and the elastic modulus first increases but then decreases.
出处 《表面技术》 EI CAS CSCD 北大核心 2013年第5期15-18,31,共5页 Surface Technology
基金 国家自然科学基金项目(51272033)
关键词 氮化铜薄膜 射频磁控溅射 微结构 纳米力学 copper nitride thin film r. f. magnetron sputtering micro structure nano-mechanical
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参考文献23

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