摘要
传统的星载相机电子学系统由商用或高等级标准器件设计而成,一般来说标准器件规模较小,难以满足复杂、大规模的高分辨率相机电子学系统对体积、质量、功耗和性能上的要求。文章分析了空间高分辨率对地观测相机视频电子学的需求特点;介绍了高分辨率相机电子学集成化的发展现状;结合中国自身的技术发展水平,提出了中国高分辨率对地观测相机集成化发展的思路和技术途径。首先要研制出高性能和高集成度的单片专用集成电路,在规模上可以采用先进的封装技术,如系统封装(System in a Package,SIP)进行扩展。初步研究表明,该技术途径是可以实现的。该项技术不但可以满足空间高分辨率对地观测相机的要求,还可以应用到其他的空间遥感器中,实现中国空间遥感相机电子学的跨越发展。
Requirements and features of imaging circuits for space borne high spatial resolution Earth observation sensors are presented. At first, the status of advanced camera electronics in other countries is introduced and analyzed to obtain inspiration. Then, with considering the development of electronics technology in China, technical approaches of camera electronics miniaturization are proposed. The first stage should be to develop high performance and high density monolithic application specific integrated circuits （ASIC） and to employ advanced packaging such as SIP in order to meet compact circuit size requirements. Preliminary research shows this technical proposal can be implemented feasibly. This miniaturization method can satisfy the high spatial resolution Earth observation camera electronics, and further can be applied to other types of space sensors.
出处
《航天返回与遥感》
2013年第3期34-41,共8页
Spacecraft Recovery & Remote Sensing
关键词
高分辨率遥感器
相机电子学
电荷耦合器件
视频电路
系统封装
专用集成电路
对地观测卫星
high spatial resolution remote sensor
camera electronics
charge coupled device
video circuits
system in a package
application specific integrated circuits
Earth observation satellite
