摘要
主要介绍了采用集束拉拔和磁控溅射方法制备高强度、高导电性Cu-Nb微观复合材料的研究情况,从微观结构、强化机制、力学性能以及电导特性等方面综述了高强高导Cu-Nb复合材料的研究现状,并指出了其进一步的研究方向及发展前景。
The studies of high strength and high conductivity copper-niobium micro-composites prepared by bundling and drawing （BgaD） and magnetron sputtering technique are introduced. The present researches on the microstructure, strengthening mechanisms, mechanical performance and conducting mechanisms are reviewed. The research direction and development prospect for high strength and high conductivity Cu-Nb micro-composites are also pointed out.
出处
《材料导报》
EI
CAS
CSCD
北大核心
2013年第11期50-53,69,共5页
Materials Reports
基金
国家自然科学基金(51031002)
国家高新技术发展"863"计划(2007AA03Z513)
关键词
Cu-Nb微观复合材料
集束拉拔
磁控溅射
高强度
高导电
Cu-Nb micro-composites, bundling and drawing, magnetron sputtering, high strength, high con- ductivity
