摘要
随着电子技术的发展,对集成电路封装工艺的要求越来越高。封装核心工序中划片工序造成的晶圆崩裂问题是一个工艺难点,也是制约封装行业发展的瓶颈之一。本文主要对晶圆崩裂的机理进行了分析,探讨了晶圆切割过程中影响其崩裂的各关键因素,从而针对性的提出了预防晶圆崩裂的有效方法。
With the development of electronic technology, the packaging technology of integrated circuit is required to be more and more advanced. The wafer crack problems caused by dicing during the core package process is a technical difficulty, and it is also one of the bottlenecks of controlling the development of pac paper, the mechanism of wafer crack is analyzed, the key parameters of effecting the crack process are investigated, and the methods of preventing from wafer cracking are put forward. kaging industry. In this during the wafer cutting
出处
《中国集成电路》
2013年第6期56-60,共5页
China lntegrated Circuit
关键词
切割
划片刀
崩裂
晶圆
Dicing
Dicing blade
Crack
Wafer
