摘要
集成电路小型化正在推动圆片向更薄的方向发展,超薄圆片的划片技术作为集成电路封装小型化的关键基础工艺技术,显得越来越重要,它直接影响产品质量和寿命。本文从超薄片划片时常见的崩裂问题出发,分析了崩裂原因,简单介绍了目前超薄圆片切割普遍采用的STEP切割工艺。另外,针对崩裂原因,还从组成划片刀的3个要素入手分析了减少崩裂的选刀方法。
technology, The trend of small outline IC is leading to thinner wafer development. The uhrathin wafer sawing which is the key and directly affects the product quality basic technology and reliability. to small outline IC, is becoming more and more important, as it This article focuses on the usual problem of die chip and crack in ultrathin wafer sawing, analyses the defect causes, and briefly introduces the step sawing technology which is widely used in current ultrathin wafer sawing. Besides, it analyses the method of blade selection to reduce the die chip defect based on the 3 main factors of blade.
出处
《中国集成电路》
2009年第8期66-69,共4页
China lntegrated Circuit
关键词
超薄圆片
崩片
背崩
正面崩片
崩裂
划片刀过载
ultrathin wafer
die chip
backside chip
topside chip
die chip and crack
blade overloading
