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基于FIB的微观变形载体制作技术研究及应用 被引量:2

Fabrication and Application of Microscale Deformation Carrier based on FIB
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摘要 变形载体包括光栅、散斑和标记点等,是光学变形测量时的重要载体,关系到测试的成败。基于聚焦离子束(FIB)微加工平台和技术,介绍了微观变形载体的设计、制作方法、程序等要点,并且利用FIB刻蚀微型孔、槽等实现材料表面微观残余应力的测量。分析和讨论了FIB制作变形载体对原有结构的影响和由此引起的残余应力测试误差。结果表明,FIB刻蚀作为一种新型的直写微纳米加工技术,结合高倍显微镜对视场的切换,可以在关键微区准确定位,并制作变形载体和实现变形测量,尤其对残余应力的测量特别有效。 Deformation carriers,including grating,speckle and dot,are important for optical deformation measurement,which is related to the success or failure of measurement.Based on FIB micromachining system and techniques,the designing,fabrication method and procedure of microscale deformation carriers are introduced in this paper.The measurement of microscale residual stress on material surface was realized by using FIB drilling and cutting.The influence of deformation carriers fabricated by FIB on the original structure and the corresponding measurement errors of residual stress were analyzed and discussed.Results show that microscale deformation carriers can be conveniently fabricated by FIB direct writing,and the target area can be accurately located and clearly imaged by switching view-fields of microscope.In addition,it's effective for microscale mechanical testing,especially for residual stress measurement.
出处 《实验力学》 CSCD 北大核心 2013年第2期151-157,共7页 Journal of Experimental Mechanics
基金 国家自然基金(11172151 90916010 11232008)资助
关键词 变形载体 聚焦离子束 残余应力 光测力学 deformation carrier focused ion beam residual stress photomechanics
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