摘要
随着微电子工业的不断发展,高介电常数材料的发展已成为制约电子器件微型化、高速化的关键因素之一。本文以钛酸钡核碳化钛为填料,经硅烷偶联剂改性后按一定比例添加到聚酰亚胺中,制备出钛酸钡/碳化钛/聚酰亚胺(BaTiO3/TiC/PI)三元复合薄膜。对复合薄膜的显微结构及性能进行了分析。实验结果表明,无机填料在复合薄膜中具有较好的分散性,说明硅烷偶联剂改性后无机粉体与聚酰亚胺基体的相容性增加。性能测试表明,随着无机填料含量的增加,三元复合薄膜的拉伸强度和断裂伸长率均下降,而导电性能则逐渐提高。
With the development of the microelectronics industry, the development of high dielectric constant materials have become one of the key factors restricting the rapid miniaturization of electronic devices. In this pa- per, the barium titanate （BaTiO3） and titanium carbide （TIC） are chosen as fillers and added into the polyimide matrix to fabricate the BaTiOdTiC/PI composite films. The microstructure and properties of the composite films were analyzed. The experimental results showed that the inorganic fillers had a rather good dispersion in the com- posite film, which should be attributed to the increased compatibility between inorganic powders and polyimide matrix after the inorganic powders were modified by silane coupling agent. The performance test showed that, with the increase of inorganic filler content, the tensile strength and elongation at break of composite films decreased, while the conductivity increase.
出处
《化学工程师》
CAS
2013年第3期75-78,共4页
Chemical Engineer
关键词
钛酸钡
碳化钛
聚酰亚胺
制备
性能
barium titanate
titanium carbide
polyimide
fabricate
property
