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Ti或Al添加对Zr_(50)Cu_(50)非晶合金/W润湿行为和界面特性的影响 被引量:2

EFFECTS OF THE ADDITION OF Ti OR Al ON THE WETTING BEHAVIORS AND INTERFACIAL CHARACTERISTICS OF Zr_(50)Cu_(50) BULK METALLIC GLASS/W SUBSTRATE
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摘要 采用座滴法研究了在真空条件下,Al或Ti对Cu_(50)Zr_(50)非晶合金与W基片之间的润湿行为和界面结合状态的影响.借助SEM和XRD分析了添加Al或Ti对Cu_(50)Zr_(50)非晶合金/W界面微观结构和界面结合机制的影响.结果表明:Al或Ti的添加有利于降低Cu_(50)Zr_(50)非晶合金熔体的表面张力,从而改善了其与W之间的润湿性;在实验范围内,Cu_(50)Zr_(50)非晶合金/W界面附近有新相ZrW_2生成,添加Al或Ti对Cu_(50)Zr_(50)非晶合金/W界面微观结构的影响不同,Al的添加促进了界面反应的进行,随着Al的添加量增加,界面反应产物ZrW_2相在界面处形成的连续反应层减小,而在熔体中富Al且贫Cu的相中析出的量增大.Ti的添加抑制了界面反应的进行,随着Ti的添加量增加,界面反应物ZrW_2逐渐消失,进而使界面结合机制由最初的溶解扩散和界面反应型混合机制转变为单独的溶解扩散型. In order to get the good performance of metal W reinforced Zr-based bulk metallic glass (BMG) matrix composites, it is necessary to understand the effects of alloy elements on the wettability between Zr-based BMG and W substrate. In this work, the effects of the addition of Ti or Al on the wetting behaviors and interfacial characteristics of ZrsoCu50 BMG on W substrate were studied at different temperatures in a high vacuum by using a sessile drop technique. The SEM and XRD were used to analyze the microstructure and bonding mechanism of the ZrsoCu50 BMG / W interface with the addition of Ti or A1 element. The results show that the wetting angle of ZrsoCuso molten alloy on W substrate decreases with increasing content of Ti or A1 in liquid Zr50Cuso and experimental temperature. The wettability of Zr50Cu50 BMG on W substrates is improved because the surface tension of Zr50Cuso molten alloy decreases with increasing content of Ti or A1. It is found that the behavior between Zr50Cu50 BMG and W substrate is reactive wetting in nature, and there exists a new ZrW2 phase precipitated in the vicinity of the ZrsoCu50 BMG/W interface. The addition of Ti or A1 element has different effects on the microstructure and bonding mechanism of Zr50Cuso BMG /W interface. On the one hand, the addition of A1 element promotes the interracial reaction. With increasing content of A1, continuous reaction layers of ZrW2 phase in the interface reduce, and there are massive precipitates of Al-rich and Cu--poor phases in molten ZrsoCu^o alloy. On the other hand, the addition of Ti element restrains the interfacial reaction which gradually disappears with increasing content of Ti.
出处 《金属学报》 SCIE EI CAS CSCD 北大核心 2013年第4期495-500,共6页 Acta Metallurgica Sinica
基金 国家重点基础研究计划项目2011CB606301 国家自然科学基金项目50825402 辽宁省博士启动基金项目20111019资助~~
关键词 Cu_50Zr_50非晶合金 W基片 Al TI 润湿性 Zr5oCu5o bulk metallic glass (BMG), W substrate, A1, Ti, wettability
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