摘要
在笔记本生产行业,BGA焊点内存在气泡是一种普遍并且难以避免的现象。选用不同球径及合金成分的BGA进行回流焊,观察焊点内气泡的分布情况。结果发现,BGA内外部的温差会导致元件四个角落以及边缘比内部的气泡率大;此外BGA锡球与锡膏熔融时产生的时间差也会对气泡率的大小产生影响。该发现为产线有效降低气泡率提供了有力的依据,同时对PCB电路设计也具有一定的参考价值。
In the notebook manufacturing industry, void is a universal phenomenon in the solder joint, and it is difficult to eliminate. Observe the void distribution in the BGAs which have different ball-diameter and alloy composition. The results show that the different temperature between BGA external and inside will lead to void varying. The void rate in four corners and edges is higher than that of the inside. Besides, the melting time difference between BGA solder ball and solder paste also has impact on void rate. This discovery provides a strong basis for the production line effectively reduce the void rate. It also has certain reference value for PCB circuit design.
出处
《电子工艺技术》
2013年第2期96-99,共4页
Electronics Process Technology
关键词
BGA
气泡率
熔融时间差
温差
BGA
Solder void rate
Melting time difference
Temperature difference
