摘要
主要研究了磁控溅射铜靶材刻蚀行为。通过改变同轴线圈中励磁电流的大小来调节铜靶表面磁场的分布,研究不同励磁电流及时间下刻蚀环的形貌,并研究了刻蚀形貌随时间的变化规律。采用轮廓仪测量靶材刻蚀环的轮廓。结果表明,采用不同励磁电流的靶材刻蚀形貌为高斯曲线状,刻蚀深度与励磁电流及刻蚀时间呈线性关系,刻蚀环的宽度随刻蚀时间的增加先增加,然后达到一个固定值34 mm,刻蚀环的中心位置距靶圆心的距离随励磁电流增加从26 mm减小到20 mm。
The etched behavior of Cu target was studied on magnetron sputtering. The magnetic field distribution in Cu target surface was adjusted by changing the coaxial coil current. The etched ring in different coil current and etching time were investigated. Contourgraph is used to depict the morphology of the etched ring. It is described that the etched pattern is a Gauss curve in each coil current, the depth of the ring is linear with coil current and etching time, but the width firstly increases and then keeps a constant value 34 mm with etching time increasing, the distance between target center and the center of the trace is decreased from 26 mm to 20 mm.
出处
《金属热处理》
CAS
CSCD
北大核心
2013年第2期99-102,共4页
Heat Treatment of Metals
关键词
磁控溅射
励磁电流
刻蚀形貌
magnetron sputtering
coil current
etched morphology
