摘要
以电子束真空熔炼直接定向凝固技术制备5N高纯铜大铸锭为研究目标,利用电子束熔炼原材料,熔体直接定向凝固后得到高纯铜铸锭。采用GDMS-VG9000辉光放电质谱仪和TCH600氧氢分析仪研究了金属杂质及氧氢元素的去除效果,通过EPMA-1600电子探针研究了提纯后元素的分布情况。结果表明:真空电子束熔炼直接定向凝固技术可将原料为4N(99.9988711%)的电解阴极铜板,制备出纯度5N(99.9997235%)、Φ59mm大尺寸高纯铜铸锭,杂质元素总量降低了75.506%,中间凝固组织为单晶;五种含量较高的元素Ag、Cu、O、P和S均匀分布,没有出现杂质的偏聚现象;与原材料相比,O、H元素分别降低了86.47%,85.00%。研究表明真空电子束精炼直接定向凝固技术能够制备氧氢含量较低的5N大尺寸高纯铜铸锭。
A novel technique was developed to prepare the ultra high purity copper,99.999%（5N）,by electron beam refining and directional solidification in vacuum with 4N electrolyte cathode copper as the raw material.The removal of the oxygen,hydrogen and metallic impurities,and the depth profile of the purified copper as well,were evaluated with glow discharge mass spectroscopy and conventional oxygen and hydrogen analyzer.The results show that the newly-developed technique is capable of producing the 5N pure,polycrystalline copper ingot casting,59 mm in diameter,with the total impurity reduction of over 75.506%.The distributions of the five main contents,including Cu,Ag,O,P and S,was found to be fairly uniform,with no observable segregation.Moreover,the O and H contents were reduced by 86.47% 85.00%,respectively.
出处
《真空科学与技术学报》
EI
CAS
CSCD
北大核心
2013年第1期77-81,共5页
Chinese Journal of Vacuum Science and Technology
关键词
5N高纯铜
单晶
电子束熔炼
定向凝固
5N ultrahigh purity copper
Single crystal
Electron beam refining
Directional solidificatio
