摘要
通过实验研究了印刷电路板(print circuit board,PCB)设计对小尺寸薄型封装(thin small outline package,TSOP)焊点可靠性的影响.实验制作了包含引脚焊盘的长度、焊盘的表面处理方式及背靠背的双面贴装偏移量3种设计参数的可靠性测试板,并采用表面贴装工艺(surface mount technology,SMT)将TSOP器件焊接到测试板上;经-40～85℃的高低温循环试验后,收集了TSOP引脚焊点裂纹的生长数据;讨论了焊点失效的机理,相应考虑了2种可靠性判断准则,并对各参数条件下的裂纹数据进行比较.结果表明,长尺寸焊盘、有机保焊膜(organic solderability preservatives,OSP)及不对称的两面布置方式有助于提高TSOP引脚的焊点可靠性.
The influence of print circuit board design on solder joint reliability （SJR） of thin small outline package （TSOP） has been investigated in a specifically designed experiment. The S JR test board includes three layout parameters. The TSOP component has been soldered to the test board under surface mount process. Solder joints＇ crack length subject to each design parameter has been measured after the samples went through thermal cycling from -40 to 85 ~C. The mechanism of solder joint crack has been discussed. In addition, two judgment criteria are chosen according to the crack length. The results show that S JR of TSOP can be improved by long size pad, organic solderability preservatives （OSP） surface finish and offset double placement.
出处
《上海大学学报（自然科学版）》
CAS
CSCD
北大核心
2012年第6期561-566,共6页
Journal of Shanghai University:Natural Science Edition
基金
上海市重点学科建设资助项目(S30107)
航空科学基金资助项目(20100241007)
关键词
小尺寸薄型封装
焊点可靠性
失效机理
thin small outline package （TSOP）
solder joint reliability （SJR）
failure mechanism
