摘要
主要介绍了浸焊机的一种全新结构设计以及从电路板的抓取、焊锡面的检测方法等浸焊工艺上进一步探讨如何提高电路板的浸焊质量。同时对助焊剂、焊料的选择进行了深入探讨,进一步探究影响浸焊质量的因素。
It was introduced that tile immersion welding machine is a kind of new structure design, and from dip soldering technology furtiler explore how to improve the circuit board dip soldering quality, including the circuit boards grab, solder surface method etc. At the same time, the choice of solder flux were discussed thoroughly, further exploralion of influence factors on the quality of the dip sohlering.
出处
《汽车零部件》
2012年第11期88-92,共5页
Automobile Parts
关键词
浸焊
电路板
浸焊质量
焊料
Dip soldering
PCB
Dip soldering quality
Solder
