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无镍枪色锡-钴合金电镀工艺 被引量:4

Technology for Nickel-Free Gun-Color Tin-Cobalt Alloy Electroplating on Copper
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摘要 为了节约镍资源及降低传统枪色电镀产品的毒性,开发了一种无镍枪色锡-钴合金电镀工艺:采用焦磷酸盐体系并添加光亮剂直接在铜片表面进行锡-钴合金电镀。探讨了镀液组成、温度、pH值及电流密度对镀层外观、镀液稳定性的影响,确定了其最佳工艺参数:250.0 g/L焦磷酸钾,20.0 g/L硫酸亚锡,15.0 g/L硫酸钴,0.6 g/L光亮剂1,2.0 g/L光亮剂2,3 mL/L 25%氨水,温度45℃,pH值8.5,电流密度0.5 A/dm2,施镀时间3 min。该工艺所得镀层颜色呈枪色,均匀致密,附着力好,且镀液稳定。 To conserve nickel resources and reduce the toxicity of traditional gun-color plating products,brighteners were introduced into pyrophosphate system for Sn-Co alloy electroplating on copper sheets and a process for nickel-free gun color Sn-Co alloy electroplating on copper was established.The effects of bath composition,temperature,pH value and current density on coating appearance and bath stability were investigated;and the optimal electroplating parameters were established.Results show that the plating bath has an optimal composition of 15.0 g/L stannous sulfate,20.0 g/L cobalt sulphate,0.6 g/L brightener 1,2.0 g/L brightener 2,and 3 mL/L 25% ammonia;and the optimal electroplating parameters are suggested as bath temperature of 45 ℃ and bath pH value of 8.5 as well as current density of 0.5 A/dm2 and plating time of 3 min.The gun-color Sn-Co alloy coating prepared under the optimal electroplating parameters is compact and uniform and well adhered to copper substrate,while the plating bath with the optimal composition has good stability.
出处 《材料保护》 CAS CSCD 北大核心 2012年第10期39-41,1,共3页 Materials Protection
关键词 锡-钴合金电镀 焦磷酸盐 硫酸亚锡 硫酸钴 枪色 工艺参数 tin-cobalt alloy electroplating nickel-free pyrophosphate system stannous salfate cobalt salfate gun-color technology copper sheet
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