摘要
焊膏印刷是SMT/表面组装技术的核心工艺,其加工质量的优劣关系到后序组装、回流焊、封装及产品整体性能。文章首先介绍了通过金属箔掩模版、激光打孔不锈钢掩模版进行焊膏丝印的技术,并介绍了国外研发成功的一种焊膏喷印新技术。同时,对两种工艺技术的原理、特点和优势进行了详细比较。当前微电子业界焊膏网印过程中,一般大量使用丝网印刷来获取高质量的焊膏图形,但多种硬件参数、操作员个人经验因素等综合因素会影响到最终加工效果。比较而言,焊膏喷印方式自动化程度高,可有效缩短焊膏图形最终加工结果与焊膏喷印软件中预计效果间的差距。
Solder paste printing is one of key processing technologies in SMT/Surface Mount Technology manufacture, the processing quality would impact the following surface mounting, solder-reflow and packaging, the comprehensive product quality, etc. At first,the paper introduced the solder paste screen printing technology, and a brand-new solder paste jet printing technology developed from abroad. Later, it focused on a comparison of the processing principles, characteristics and advantages of these 2 processing technologies. The present microelectronics Industry are mostly applying metal mask stencil in solder paste screen printing to push for high-quality solder pattern, but due to impacts from multi-factors like equipment parameters, operator experiencee, the screen printing quality would be effected. Comparatively speaking, the jet printing technology is highly automatic and it is capable of shortening the difference of solder patten processing qulity against the original solder pattern expectation in jet software.
出处
《电子与封装》
2012年第8期5-9,48,共6页
Electronics & Packaging
