摘要
针对HgCdTe焦平面红外探测器封装的特殊性,提出了芯片粘接胶的选用原则,影响粘接质量的主要因素,以及粘接工艺优化方法。提出了用于封装HgCdTe MW 320×256探测器的低温胶X1,并对该胶做了一系列可靠性实验。实验证明,低温胶X1满足该探测器的封装要求。
Concerning the special properties of the HgCdTe FPAIR detector package, the basic principles of adhesive selection, the main factors affecting the bonding quality, and the optimization of the die attach methods are introduced. Low-temperature adhesive X1 is proposed to package HgCdTe MW 320 ×256 detectors, and the reliability experiments show that adhesive X1 meets the package requirements.
出处
《红外技术》
CSCD
北大核心
2012年第8期444-447,共4页
Infrared Technology
