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正交设计法优化电化学浸蚀形成钛合金表面微结构工艺 被引量:1

Micro-structure on the Surface of Titanium Alloy Via Electrochemical Etching by Orthogonal Design
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摘要 目的:采用正交设计法,对电化学浸蚀形成钛合金表面微结构工艺参数进行优化。方法:先采用L9(33)正交实验对钛合金表面进行阳极浸蚀处理,HCl浓度(A)、HF浓度(B)、NH4F浓度(C)作为3个因素。上述方法获得表面再用L9(33)正交实验进行交流电化学浸蚀处理,HNO3浓度(X)、电压(Y)、蚀刻时间(Z)作为3个因素。结果:获得最优微米表面的条件是:HCl酸浓度:99g/L、HF酸浓度:51g/L、NH4F盐浓度15g/L;获得最优亚微米孔表面的条件是:HNO3酸浓度:246g/L、电压4V、蚀刻时间40s。结论:影响微米表面主要因素是HF浓度,影响亚微米表面主要因素是电压。 Objective: To investigate the parameters of micro-structure on the surface of titanium alloy via electrochemical etching by orthogonal design. Methods: Treat the surface with anode erosion by using L9 (33) orthogonal design test. Three factors, such as concentration of HCI(A), concentration of HF(B) and concentration of NH4 F(C) were chosen by the observation of orthogonal design. It, then, was treated with alternating current (AC) electrochemical etching by orthogonal design test, ditto. The three factors were set up as concentration of HNO3 (X), voltage(Y) and etching time(Z). Results: The parameters of the optimal micron surface were that concentration of HCl:99g/L,concentration of HF: 51g/L, concentration of NH4F: 15g/L. The parameters of optimal submicron surface were concentration of HNO3:246 g/L, voltage: 4V, etching time: 40s. Conclusion: Concentration of HF was the main factors in affecting the percentage of micro holes. Voltage was the main factors in affecting the pattern of sub--micron holes.
出处 《口腔医学研究》 CAS CSCD 2012年第8期763-766,共4页 Journal of Oral Science Research
基金 国家自然科学基金资助项目(基金号:81141063) 吉林省科技厅资助项目(基金号:200905175)
关键词 正交设计 电化学浸蚀 钛合金 微米孔 亚微米孔 Orthogonal design Electrochemical etching Titanium alloy Micron pore Sub--micron pore
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