摘要
利用差示扫描量热法研究了AG - 80环氧树脂和环氧封端酚酞聚芳醚腈 (简称E -PCE)共混物中固化剂含量对树脂基体固化反应温度、反应热的影响。此共混环氧树脂基体的最低固化反应温度为1 61 .3℃ ,固化反应表观活化能为 60 .66kJ/mol,固化反应级数为 0 .875。
The effect of curing agent DDS contain in AG-80/E-PCE blend epoxy resin matrix on temperature and heat of the curing reaction were studied by means of differential scanning calorimetry(DSC). The kinetic parameters of the curing reaction were obtained, with lowest curing reaction temperature 161.3℃, the apparent activation energy 60.66kJ/mol, and the curing reaction order 0.875.
出处
《中国胶粘剂》
CAS
2000年第3期24-26,共3页
China Adhesives
基金
国家自然科学基金
江西省青年科学金
关键词
环氧树脂
固化
DSC法
环氧封端
酚酞聚芳醚腈
epoxy resin
E-PCE
differential scanning calorimetry
curing reaction
kinetics of curing reaction
