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Hot Deformation Behavior of Squeeze Casting SiC_p/2 A50 Matrix Composites 被引量:4

Hot Deformation Behavior of Squeeze Casting SiC_p/2 A50 Matrix Composites
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摘要 The flow stress behaviors of squeeze casting SiCp/2A50 matrix composites were investigated by means of compression tests on a Gleeble 1500 therma1 mechanical simulator at isothermal constant strain rates ranging from of 0.001 to 1.0 with the testing temperature ranging from 350 to 500 ℃. The experiments showed that the relationship between stress and strain was obviously influenced by the strain rate and temperature. Dynamic recrystallization generally occurred at a higher temperature and a 1ower strain rate. A linear equation could be fitted between the Zener-Hollomon parameter Z and stress in the experiments. The mean value reciprocal of temperature at every true strain had a linear relation with natural logarithm of Z parameter, and the correlation coefficient, R=0.99, which was very significant by examination. The hot deformation activation energy of SiCp/2A50 matrix composites was 163.47 KJ/mol by calculation. The flow stress behaviors of squeeze casting SiCp/2A50 matrix composites were investigated by means of compression tests on a Gleeble 1500 therma1 mechanical simulator at isothermal constant strain rates ranging from of 0.001 to 1.0 with the testing temperature ranging from 350 to 500 ℃. The experiments showed that the relationship between stress and strain was obviously influenced by the strain rate and temperature. Dynamic recrystallization generally occurred at a higher temperature and a 1ower strain rate. A linear equation could be fitted between the Zener-Hollomon parameter Z and stress in the experiments. The mean value reciprocal of temperature at every true strain had a linear relation with natural logarithm of Z parameter, and the correlation coefficient, R=0.99, which was very significant by examination. The hot deformation activation energy of SiCp/2A50 matrix composites was 163.47 KJ/mol by calculation.
作者 徐宏 张新
出处 《Journal of Wuhan University of Technology(Materials Science)》 SCIE EI CAS 2012年第3期443-449,共7页 武汉理工大学学报(材料科学英文版)
关键词 SiCp/2A50 matrix composites deformation activation energy stress and strain dynamic recrystallization SiCp/2A50 matrix composites deformation activation energy stress and strain dynamic recrystallization
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