摘要
电子封装内部缺陷的尺度微小,引脚焊接的间距也很小,传统检测方法很难对其进行检测。超声显微技术利用聚焦高频超声来进行检测,能对试样表面、亚表面及其内部一定深度内的细微结构进行显微成像,可用来检测电子封装和评估焊接质量。文章采用高速数据采集卡、高频超声聚焦换能器、宽频脉冲收发仪与高精度运动系统,研发了一套超声显微镜系统。该系统具有较高的精度,功能基本完善,造价相对低廉,能进行全时域波形采集与存储。实验结果表明该系统能检测出电子封装内的微细缺陷,可用来评估引脚的焊接质量。
The size of defects in electronic package＇s is micro scale,also the space between welding pins is crowd,so that it difficult to inspect it with traditional testing method.Scanning acoustic microscopy（SAM）with high-frequency focused ultrasound can be used to get deep insight on the micro structure.In this paper,an complete SAM system has been developed including a high-speed data acquisition card,high-frequency ultrasonic focus transducers,a broad band pulse transmitter/receiver,and a high-precision motion system.so this SAM system has some features like high accuracy,high-performance and low cost.Also several advanced non-destructive techniques are accomplished such as full-wave sampling,storing,and dynamical imaging.The inspection results on electronic packages proved that this SAM system can be a useful tool to find electronic package＇s inner micro defects and evaluate the welding quality of the pins.
出处
《电子与封装》
2012年第3期1-5,24,共6页
Electronics & Packaging
基金
国家自然科学基金(50975028)
高等学校学科创新引智计划项目资助(B08043)
关键词
超声显微镜
全波采集
电子封装
无损检测
scanning acoustic microscopy
electronic package
full-wave acquisition
non-destructive testing
