摘要
将二苯基二氯硅烷经过氢化铝锂还原为二苯基硅烷,再与4-乙烯基环氧环己烷进行硅氢加成后合成了1种新型含硅环氧树脂二[2-(3,4-环氧环己基)乙基]二苯基硅烷(EODPS)。该树脂的折光指数达到1.567,并具有较好的透明度。采用甲基六氢苯酐和乙酰丙酮铝-二苯基硅醇组合物分别对EODPS进行固化。通过红外光谱,DSC分析表征了EODPS的结构,研究了其固化活性,并对固化后产物的热稳定性、力学性能和吸水性进行了测试,且与脂环族环氧树脂CEL-2021P性能进行了比较。结果表明,与CEL-2021P相比,EODPS具有更高的热稳定性和更低的吸水率,可用于LED封装。
A new silicon-containing epoxy resin di[2-（3,4-epoxycyclohexylethyl）]diphenylsilane（EODPS） was synthesized by two reactions： first the diphenyldichlorosilane was reduced to diphenylsilane by lithium aluminum hydride and then the diphenylsilane was hydrosilylated with 1,2-epoxy-4-vinylcyclohexane.The refractive index of EODPS was up to 1.567 and the resin had good transparency.The methyhexahydrophthalic and aluminum acetylacetonate/diphenylsilandiol compound were used to cure EODPS.The structure of EODPS was characterized and its curing reactivity were investigated by FTIR and DSC.The thermal stability,mechanical properties and water absorption of the cured product were tested and compared with cycloaliphatic epoxy resin CEL-2021P.The results indicated that the cured EODPS had better thermal stability and lower water absorption and could be used for LED encapsulation.
出处
《热固性树脂》
CAS
CSCD
北大核心
2012年第2期6-10,共5页
Thermosetting Resin
关键词
含硅环氧树脂
高折光指数
发光二极管封装
热稳定性
吸水率
silicon-containing epoxy resin
high refractive index
LED encapsulation
thermal stability
water absorption
