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高温退火处理下SiN_x薄膜组成及键合结构变化 被引量:4

The variations in composition and bonding configuration of SiN_x film under high annealing temperature treatment
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摘要 采用等离子增强化学气相沉积法,以氨气和硅烷为反应气体,p型单晶硅为衬底,低温下(200℃)制备了非化学计量比氮化硅(SiN_x)薄膜.在N_2氛围中,于500-1100℃范围内对薄膜进行热退火处理.室温下分别使用Fourier变换红外吸收(FTIR)光谱技术和X射线光电子能谱(XPS)技术测量未退火以及退火处理后SiN_x薄膜的Si-N,si-H,N-H键键合结构和si 2p,N 1_s电子结合能以及薄膜内N和si原子含量比值R的变化.详细讨论了不同温度退火处理下SiN_x薄膜的FHR和XPS光谱演化同薄膜内Si,N,H原子间键合方式变化之间的关系.通过分析FTIR和XPS光谱发现退火温度低于800℃时,SiN_x薄膜内Si-H和N-H键断裂后主要形成si-N键;当退火温度高于800℃时薄膜内Si-H和N-H键断裂利于N元素逸出和si纳米粒子的形成;当退火温度达到1100℃时N_2与SiN_x薄膜产生化学反应导致薄膜内N和Si原子含量比值R增加.这些结果有助于控制高温下SiN_x薄膜可能产生的化学反应和优化SiN_x薄膜内的Si纳米粒子制备参数. Non-stoichiometric silicon nitride(SiN_x) thin films are deposited on p-type crystalline silicon substrates at low temperature (200℃) using ammonia and silane mixtures by plasma enhanced chemical vapor deposition.The evolutions of Si—N,Si—H and N—H bonding configurations,the variations of Si 2p and N 1s electron binding energy and the ratio R of nitrogen to silicon atoms in SiN_x films annealed at temperature in a range of 500—1100℃are investigated at room temperature by Fourier transform infrared spectroscopy(FTIR) and X-ray photoelectron spectroscopy(XPS),respectively.The relationship between the evolutions of FTIR and XPS spectroscopy of the samples at different annealing temperatures and the variations of bonding configurations of Si,N and H atoms is discussed in detail.According to the arguments about FTIR and XPS spectroscopy we conclude that when the annealing temperature is lower than 800℃,the breakings of Si—H and N—H bonds in the SiN_x films lead mainly to the formation of Si—N bonds;when the annealing temperature is higher than 800℃,the breakings of Si—H and N—H bonds are conducible to the effusion of N atoms and the formation of silicon nanoparticles;when the annealing temperature equals 1100℃,the N_2 react on the SiN_x films to cause the ratio R of nitrogen to silicon atoms to inerease.These results are useful for controlling the probable chemical reaction in SiN_x films under high annealing temperatures and optimizing the fabrication parameters of silicon nanoparticles embedded in SiN_x films.
出处 《物理学报》 SCIE EI CAS CSCD 北大核心 2012年第1期373-378,共6页 Acta Physica Sinica
基金 华中科技大学研究生创新基金(批准号:HF07022010185) 中央高校基本科研业务费(批准号:2010MS054)资助的课题~~
关键词 SiN_x薄膜 Fourier变换红外吸收光谱 X射线光电子能谱 键合结构 SiN_x film Fourier transform infrared spectroscopy X-ray photoelectron spectroscopy bonding configurations
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同被引文献42

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