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铜件Au-Fe合金电镀主工艺条件对镀层沉积速度及其性能的影响

Effect of Electroplating Condition on Deposition Rate and Performance of Electroplated Au-Fe Coating on Copper Wares
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摘要 为获得性能良好的Au-Fe合金镀层,在以KAu(CN)2,FeSO4,KCN及柠檬酸钾为主要成分的镀液中对铜件进行电镀,沉积出了装饰性Au-Fe合金镀层。采用扫描电镜、原子吸收光谱以及弯曲、热浸和人工汗试验研究了KAu(CN)2浓度、FeSO4浓度、镀液pH值及温度对Au-Fe合金沉积速度的影响和镀层的性能。结果表明:12 g/LKAu(CN)2,4 g/L FeSO4,温度40℃,pH值为3.6的工艺条件下所得的Au-Fe合金镀层的结合力和耐蚀性较好;该工艺条件下,Au-Fe合金沉积速度为16.36μm/h。 KAu(CN)2,FeSO4,KCN and potassium citrate were used to formulate the bath for decorative Au-Fe alloy electroplating of copper wares.The effects of the concentration of KAu(CN)2 and FeSO4 as well as the pH value and temperature of the plating bath on the deposition rate and performance of Au-Fe alloy coating were analyzed using a scanning electron microscope and an atomic absorption spectrometer as well as facilities for bending test,hot-dipping test and artificial sweat test.Results show that Au-Fe alloy coating with good adhesion to substrate and good corrosion resistance can be prepared by electroplating in the bath containing 12 g/L KAu(CN)2 and 4 g/L FeSO4 at a temperature of 40 ℃ and pH value of 3.6,and the deposition rate of relevant Au-Fe alloy coating is 16.36 μm/h.
出处 《材料保护》 CAS CSCD 北大核心 2011年第12期43-44,66,共3页 Materials Protection
基金 广东高校土建工程技术开发中心资助[粵教(2010)118]
关键词 Au—Fe合金 铜件 电镀 工艺条件 镀层性能 Au-Fe alloy copper wares electroplating electroplating condition performance of coating
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