摘要
某厂从20世纪70年代起一直用海波(即硫代硫酸钠)电镀银加工铜件,但工作电流只允许0.1~0.3A/dm^2,镀速慢,生产效率低。为此开发了一种海波镀厚银工艺,其镀液配方及工艺条件为:硝酸银55 g/L,无水亚硫酸钠40 g/L,硫代硫酸钠500 g/L,柠檬酸钾40 g/L,温度30℃,pH 5~6,阴极电流密度0.4~1.0A/dm^2,阴阳极面积比1:(2~3)。采用该工艺后,镀速提高了1倍。
A thiosulfate （also called hyposulfite） silver electroplating process has been applied to treat copper workpieces in a company from the 1970s. It has disadvantages of slow deposition and low production efficiency due to the fact that its allowable current density is only 0.1-0.3 A/dm2. To solve this problem, a new process for thick silver electroplating was developed. Its bath composition and operation conditions are as follows： silver nitrate 55 g/L, anhydrous sodium sulfite 40 g/L, sodium thiosulfate 500 g/L, potassium citrate 40 g/L, temperature 30 ℃, pH 5-6, cathodic current density 0.4-1.0 A/dm2, and cathode-to-anode area ratio 1：2 to 1：3. The deposition rate is doubled after using the new process.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2016年第1期44-45,共2页
Electroplating & Finishing
关键词
无氰镀银
硫代硫酸盐
厚度
沉积速率
cyanide-free silver electroplating
thiosulfate
thickness
deposition rate
