摘要
The molecular dynamics method is used to simulate microcrack healing during heating or/and under compressive stress.A centre microcrack in Cu crystal would be sealed under compressive stress or by heating.The role of com- pressive stress and heating in crack healing was additive.During microcrack healing, dislocation generation and motion occurred.When there were pre-existing disloca- tions around the microcrack,the critical temperature or compressive stress necessary for microcrack healing would decrease,and,the higher the number of dislocations, the lower the critical temperature or compressive stress.The critical temperature necessary for microcrack healing depended upon the orientation of the crack plane. For example,the critical temperature for the crack along the(001)plane was the lowest,i.e.770K.
The molecular dynamics method is used to simulate microcrack healing during heating or/and under compressive stress.A centre microcrack in Cu crystal would be sealed under compressive stress or by heating.The role of com- pressive stress and heating in crack healing was additive.During microcrack healing, dislocation generation and motion occurred.When there were pre-existing disloca- tions around the microcrack,the critical temperature or compressive stress necessary for microcrack healing would decrease,and,the higher the number of dislocations, the lower the critical temperature or compressive stress.The critical temperature necessary for microcrack healing depended upon the orientation of the crack plane. For example,the critical temperature for the crack along the(001)plane was the lowest,i.e.770K.
基金
The project supported by the Special Fund for the Major State Basic Research Projects(No.G19990650)and by the National Natural Science Foundation of China(No.19891180
59871010)
