摘要
采用两种铜基钎料HL841(CuZnMnSnNiCo合金)和HL105(CuZnMn合金)对YG8硬质合金和低碳钢进行真空钎焊,并对比研究了焊缝的微观组织、元素扩散情况及接头抗拉强度。研究表明:两种钎料与硬质合金结合处形成互溶区,HL105形成的互溶区宽度大概为1μm,而HL841形成的互溶区宽度约为3μm;HL841钎料中的Co、Ni等元素有利于形成Fe-Co-Ni单相固溶体,同时钎焊过程中钎料中的Co还能缓解硬质合金中粘结相Co的扩散流失。这些原因使得采用HL841焊接的试样的接头力学性能优于HL105。
The vacuum brazing of WC-8%Co and low carbon steel was conducted by using HL841 and HL105 as filler metals,and the microstructure,element diffusion and tensile strength of the joints were compared.Comparative results show that miscible zone is obtained between solders and cemented carbides.The width of the miscible zone using HL105 is about 1 μm and the width using HL841 is approximately 3 μm.Co and Ni elements in HL841 solder are conductive to the formation of Fe-Co-Ni single-phase solid solution and the HL841 can alleviate the diffusion of Co in the cemented carbides.These result in that the welding mechanical properties of HL841 is better than HL105.
出处
《硬质合金》
CAS
北大核心
2011年第5期305-310,315,共7页
Cemented Carbides
关键词
硬质合金
低碳钢
钎料
真空钎焊
cemented carbide
low carbon steel
solder
vacuum brazing
