摘要
建立了功率型LED结构,分析了其热阻模型,对采用高导热导电银胶、纳米银焊膏、大功率芯片键合胶、Sn70Pb30四种键合材料的LED进行了ANSYS有限元软件仿真对比研究。结果表明,纳米银焊膏具有最优的传热特性。采用了正向电压法对3W蓝光LED进行了热阻测量,其数值与仿真结果基本相符,验证了模拟仿真结果的真实性。
The structure of power type LED was established, and its thermal resistance model was analyzed. The LEDs fabricated with four bonding materials of high thermal conductivity silver paste, nano-silver paste, high power chip bonding glue, and SnTOPb30 respectively were simulated comparatively by using ANSYS finite element software. The results show that nano-silver paste has the best heat transfer characteristic. Forward voltage method was used to measure the heat resistancein of a 3 W blue LED, and the tested value agree well with the simulation results.
出处
《半导体光电》
CAS
CSCD
北大核心
2011年第4期517-520,共4页
Semiconductor Optoelectronics
基金
湖南省科技计划项目(2010GK3182)
邵阳市科技计划项目(C0926)
