摘要
Contact reactive brazing of 6063 Al alloy and 1Cr18Ni9Ti stainless steel was researched by using Cu as interlayer. Effect of brazing time on microstructure of the joints, as well as the dissolution behaviors of Cu interlayer was analyzed. The results show that the product of reaction zone near 1Cr18Ni9Ti is composed of Fe2Al5, FeAl3 intermetallic compound （IMC）, and Cu-Al IMC; the near by area is composed of Al-Cu eutectic structure with Al （Cu） solid solution. With increasing the brazing time, the thickness of IMC layer at the interface increases, while the width of Al-Cu eutectic structure with Al（Cu） solution decreases. Calculation shows the dissolution rate of Cu interlayer is very fast. The complete dissolution time is about 0.47 s for Cu interlayer with 10 μm in thickness used in this study.
以Cu作为接触反应材料连接6063铝合金与1Cr18Ni9Ti不锈钢,探讨焊接工艺参数对接头组织的影响规律,分析中间反应层Cu的溶解特性结果表明:在1Cr18Ni9Ti不锈钢一侧界面反应层由Fe2Al5、FeAl3金属间化合物和Cu-Al金属间化合物构成,与之相邻区域主要含Cu-Al金属间化合物,焊缝组织由Al-Cu共晶及大块状的Al固溶体组成;随着保温时间的延长,焊缝组织最为显著的变化是在1Cr18Ni9Ti不锈钢一侧界面的金属间化合物层厚度增加,共晶组织宽度逐渐减小;中间反应层Cu的溶解速度非常迅速,是以秒为计量单位的快速过程,厚度为10μm的Cu溶解时间仅为0.47s。
