摘要
本文概述了我国及国际铜加工业的发展现状、铜合金引线框架材料的研究开发现状及稀土在铜合金中的应用,介绍了引线框架是集成电路(IC)中的重要部件。同时,提出了今后铜加工及引线框架材料的研究方向及发展趋势。
The current status of research on copper processing and the copper alloy lead frame materials in this paper were overviewed and application of rare earth elements in copper alloy,lead frame is the important components of integrated circuit（IC）.Meanwhile,the research direction and trend of the copper processing and lead frame materials are proposed.
出处
《铜业工程》
CAS
2011年第2期42-44,61,共4页
Copper Engineering
基金
国家863计划资助项目
关键词
铜加工
铜合金
引线框架材料
集成电路
发展
copper processing
copper alloy
material for lead flame
integrated circuit
development
