摘要
以生物测试上广泛使用的微流控芯片为研究对象,研究使用聚合物微型注塑方法进行类似产品大规模、批量化生产的可能性。在建立微流控芯片结构模型的基础上,运用聚合物成型分析软件Moldflow对其在不同工艺参数下的成型过程进行了系统研究。结果表明,熔体温度的改变对充填时间的影响甚微,充填时间随着注射速度的增加而明显缩短,注射压力随熔体温度的增加而减小,随注射速度的增加而增加。增加熔体温度和注射速度可以降低翘曲变形。
The micro fluidic chips were studied in this work. The configuration of the micro fluidic chips were designed by software Moldflow , which was used to simulate the micro fluidic chips under different process parameters. It showed that the melt temperature had little effect on the filling time, while filling time decreases with increasing injection speed. Injection pressure decreases with increasing melt temperature and injection speed. The warpage of the fluidic chip can be reduced by increasing the melt temperature and injection speed.
出处
《中国塑料》
CAS
CSCD
北大核心
2011年第3期61-64,共4页
China Plastics
基金
中央高校基金项目资助(ZZ1011
JD0905)
关键词
微注射成型
微流控芯片
熔体充模流动
数值模拟
micro injection molding；micro fluidic chip； melt filling flow； numerical simulation
