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结构与性能参数对单级半导体制冷器性能影响的数值分析 被引量:6

Numericalanlysis of Single-stage Thermoelectric Cooler Performance by Changing Structure and Performance Parameters
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摘要 根据半导体制冷中常用制冷量和散热量表达式和对流换热基本公式,建立起包含系统各个参数的制冷量Qc和效率COP的表达式,根据Qc和COP表达式模拟各参数变化对制冷量和COP的影响,讨论的参数包含散热端热阻Rha,制冷空间与环境的温差△T,尺寸因子G(单个热电臂横截面积与长度的比值S/L)和热电模块的对数N,结论指出在半导体制冷器设计过程中对各参数的合理选用有助于提高系统运行效率,降低能耗。 According to the basic equations used in thermoelectirc refrigeration and convective heat transfer,the expressions of Qc,COP including varuious parameters are established.Influence on the cooling capacity and performance by changing the parameters is simulated.These parameters are the hot-side thermal resistance Rha,the temperature difference between refrigeration cabinet and external environment △T,G factor and the number of thermocouples per one thermoelectric module N.The result shows that the proper selection of these paremeters will help improving the system performance and reducing energy consumption.
机构地区 华中科技大学
出处 《流体机械》 CSCD 北大核心 2011年第2期72-76,67,共6页 Fluid Machinery
关键词 Qc G因子 TEM COP Qc G factor TEM COP
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参考文献8

  • 1刘明,程有凯.半导体制冷性能的优化[J].节能,2008,27(3):12-15. 被引量:9
  • 2李茂德,卢希红.热电制冷过程中散热强度对制冷参数的影响分析[J].同济大学学报(自然科学版),2002,30(7):811-813. 被引量:52
  • 3Jun Luo, Lingen Chen, Fengrui Sun, et al. Optimum al-location of heat transfer surface area for cooling load and COP optimization of a thermoelectric refrigerator [J]. Energy Conversion and Management, 2003,44 : 3197-3206. 被引量:1
  • 4H. Y. Zhang, Y. C. Mui, M. Tarin. Analysis of thermoe-lectric cooler performance for high power electronic packages [J]. Applied Thermal Engineering, 2010(30):561-568. 被引量:1
  • 5徐德胜编著..半导体制冷与应用技术[M].上海:上海交通大学出版社,1992:243.
  • 6S. Lineykin, S. Beb-Yaakov. Analysis of thermoelectric coolers by a spice-compatible equivalent-circuit model [J]. IEEE Power Electronics Letters,2005,3:63-66. 被引量:1
  • 7张奕,张小松,胡洪,翁雯,刘佳.冷/热端散热对半导体冷藏箱性能的影响[J].江苏大学学报(自然科学版),2008,29(1):43-46. 被引量:11
  • 8S. A. Omer,S. B. Riffat,Xiaoli Ma. Experimental investigation of a thermoelectric refrigeration system emplo-ying a phase change material integrated with thermal diode (thermos)phons ) [J]. Applied Thermal Engi-neering,2001,21(12);1265-1271. 被引量:1

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