摘要
为深入研究微纳米环境中物体的受力与运动状态,实现微纳米环境下的位置感知与位移操作,建立纳米尺度下位移、力检测的理论方法,研制了一种基于厚膜陶瓷电容的微位移传感器。通过采用厚膜混合集成工艺将信号处理电路与厚膜电容芯片一体化集成,即用厚膜电路替代PCB电路板,以达到降低由于温度效应和寄生电容等导致的非线性误差,提高传感器的分辨率和稳定性的效果。传感器性能标定实验结果表明,0~1 000nm量程范围内位移检测分辨率优于2nm,传感器稳定性得到显著提高,能够用于检测纳米级微小位移变化量。此外,还从材料物理属性和电路优化设计等方面分析了一体化集成的厚膜电路相对于PCB电路板的优越性。
A novel micro-displacement sensor based on the thick film ceramic capacitor was deve-loped for further study of the dynamics and kinematics states of objects in micro/nano circumstance.It was used to realize micro/nano-scaled position sensing and operation,and establish the related theories and methods to detect the displacement and stress in nano-scale.As to the sensor,the signal processing circuit was integrated with the thick-film capacitor chip by thick-film hybrid integrated technology,in other words,the thick film circuit was used instead of the printed circuit board（PCB）,which effectively decreased the nonlinearity errors due to the temperature effect and parasitic capacitance.Thus,the resolution and stability of the micro-displacement sensor were improved.The tests were carried out to investigate the performances of the asprepared sensor.The results show that its resolution is better than 2 nm in the range of 0-1 000 nm and the stability of the sensor is significantly increased,which is sufficient for detecting the nano-scaled variation of displacement.Furthermore,the advantages of the integrated thick film circuit compared with the PCB were discussed in terms of material properties and optimal designs of electric circuits.
出处
《微纳电子技术》
CAS
北大核心
2011年第3期177-182,共6页
Micronanoelectronic Technology
基金
国家自然科学基金重点项目(60635040)
关键词
微位移传感器
厚膜电路
陶瓷电容
分辨率
集成优化
micro-displacement sensor
thick film circuit
ceramic capacitor
resolution
integrated optimization
