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Influence of nitrogen implantation into the buried oxide on the radiation hardness of silicon-on-insulator wafers 被引量:1

Influence of nitrogen implantation into the buried oxide on the radiation hardness of silicon-on-insulator wafers
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摘要 In order to improve the total-dose radiation hardness of the buried oxide of separation by implanted oxygen silicon- on-insulator wafers, nitrogen ions were implanted into the buried oxide with a dose of 1016 cm-2, and subsequent annealing was performed at 1100 ℃. The effect of annealing time on the radiation hardness of the nitrogen implanted wafers has been studied by the high frequency capacitance-voltage technique. The results suggest that the improvement of the radiation hardness of the wafers can be achieved through a shorter time annealing after nitrogen implantation. The nitrogen-implanted sample with the shortest annealing time 0.5 h shows the highest tolerance to total-dose radiation. In particular, for the 1.0 and 1.5 h annealing samples, both total dose responses were unusual. After 300-krad(Si) irradiation, both the shifts of capacitance-voltage curve reached a maximum, respectively, and then decreased with increasing total dose. In addition, the wafers were analysed by the Fourier transform infrared spectroscopy technique, and some useful results have been obtained. In order to improve the total-dose radiation hardness of the buried oxide of separation by implanted oxygen silicon- on-insulator wafers, nitrogen ions were implanted into the buried oxide with a dose of 1016 cm-2, and subsequent annealing was performed at 1100 ℃. The effect of annealing time on the radiation hardness of the nitrogen implanted wafers has been studied by the high frequency capacitance-voltage technique. The results suggest that the improvement of the radiation hardness of the wafers can be achieved through a shorter time annealing after nitrogen implantation. The nitrogen-implanted sample with the shortest annealing time 0.5 h shows the highest tolerance to total-dose radiation. In particular, for the 1.0 and 1.5 h annealing samples, both total dose responses were unusual. After 300-krad(Si) irradiation, both the shifts of capacitance-voltage curve reached a maximum, respectively, and then decreased with increasing total dose. In addition, the wafers were analysed by the Fourier transform infrared spectroscopy technique, and some useful results have been obtained.
出处 《Chinese Physics B》 SCIE EI CAS CSCD 2010年第10期380-385,共6页 中国物理B(英文版)
基金 Project supported by the Doctoral Science Foundation of University of Jinan
关键词 silicon-on-insulator wafers radiation hardness nitrogen implantation silicon-on-insulator wafers, radiation hardness, nitrogen implantation
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  • 1Kuo J B and Lin S C 2001 Low-Voltage SO1 CMOS VLSI Devices and Circuits (New York: Wiley). 被引量:1
  • 2Kuo J B and Su K W 1998 CMOS VLSI Engineering: Silicon-On-Insulator (SOI) (New York: Kluwer Academic Publishers). 被引量:1
  • 3Wolf S 2002 Silicon Processing for the VLSI Era (California: Lattice Press). 被引量:1
  • 4Schwank J R, Ferlet-Cavrois V, Shaneyfelt M R, Paillet P and Dodd P E 2003 IEEE Trans. Nucl. Sci. 50 522. 被引量:1
  • 5Barchuk I P, Kilchitskaya V I, Lysenko V S, Nazarov A N, Rudenko T E, Djurenko S V, Rudenko A N, Yurchenko A P, Ballutaud D B and Colinge J P 1997 IEEE Trans. Nucl. Sci. 44 2542. 被引量:1
  • 6Yi W B, Zhang E X, Chen M, Li N, Zhang G Q, Liu Z L and Wang X 2004 Semicond. Sci. Technol. 19 571. 被引量:1
  • 7Yang H, Zhang E X and Zhang Z X 2007 Chin. J. Semicond. 28 323. 被引量:1
  • 8Zhang E X, Sun J Y, Zhang Z X, Qian C, Jiang J, Wang x, En Y F, Luo H W, Shi Q and Zhang X W 2006 Semicond. Sci. Technol. 21 287. 被引量:1
  • 9Wu A M, Chen J, Zhang E X, Wang X and Zhang Z X 2008 Semicond. Sci. Technol. 23 015015. 被引量:1
  • 10Zhang S, Zhang Z X, Bi D W, Chen M, Tian H, Yu W J, Wang R and Liu Z L 2009 J. Semicond. 30 093002. 被引量:1

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