摘要
研究了玻璃基体上化学沉积Ni–P合金的工艺条件,讨论了碱性化学镀镍过程中硫酸镍、次磷酸钠和柠檬酸钠的质量浓度,温度以及pH对镀层沉积速率的影响,获得较佳工艺条件如下:硫酸镍30g/L,次磷酸钠25g/L,柠檬酸钠10g/L,温度45°C,pH=9。在此条件下获得的镍–磷合金镀层含磷3.2%,属于低磷镀层。采用氯化钯滴定法测得镀液的稳定时间达到30min。
The process conditions of electroless NiP alloy plating on glass substrate were studied, and the effects of mass concentrations of nickel sulfate, sodium hypophosphite and sodium citrate, temperature and pH on deposition rate were discussed. The optimal process conditions were obtained as follows： nickel sulfate 30 g/L, sodium hypophosphite 25 g/L, sodium citrate 10 g/L, temperature 45 ℃ and pH 9. A low-phosphorus nickel-phosphorus alloy deposit with 3.2% of phosphorus was obtained, and the stability time of the bath was determined to be up to 30 rain by adding a small amount of PdCl2 solution.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2010年第9期15-17,共3页
Electroplating & Finishing
关键词
碱性化学镀
镍—磷合金
玻璃基体
喷砂
alkaline electroless plating
nickel-phosphorus alloy
glass substrate
sandblasting
