摘要
无铅化电子组装中无铅焊料的高熔点、低润湿性给实际生产带来了很大挑战。为了改善润湿性,可适当提高焊接温度,但由于PCB及元件的工艺温度限制,导致了焊接工艺温度窗口变窄。氮气保护可以改善无铅焊料润湿性、防止氧化、提高焊接品质,更重要的是可以降低焊接峰值温度,扩大焊接工艺温度窗口。
The higher wetting point temperature and lower wettability of solder alloy in lead-free assembly bring major challenges to the actual production. In order to improve wettability, raising the temperature appropriately will led to the narrower soldering process window because of soldering temperature limitation for PCB and components. Nitrogen protection can improve the wettability of lead-free solder alloy, prevent the oxidation and ensure the soldering quality. More importantly, it can minimize soldering peak temperature and extend soldering process window.
出处
《电子工业专用设备》
2010年第8期36-40,59,共6页
Equipment for Electronic Products Manufacturing
关键词
氮气保护
无铅焊接
温度窗口
润湿性
N2 Protection
Lead-free Soldering
Thermal Process Window
Wettability
