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固化过程对导电胶体积电阻率的影响 被引量:13

The Effect of Curing Process on the Volume Resistivity of Electrically Conductive Adhesive
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摘要 采用三种不同固化收缩率的树脂配制了三种导电胶。通过实验研究了等温固化过程中树脂基体的固化收缩率对导电胶体积电阻率的影响。研究结果表明,树脂基体的固化收缩率越大,对应导电胶的体积电阻率越小。导电胶的体积电阻率与固化时间呈指数关系。导电胶在未固化时体积电阻率极大,其导电性的建立发生在树脂基体的凝胶化阶段,且在这一阶段中导电胶的电阻率急剧下降,凝胶化阶段完成后的导电胶电阻率变化较小。 Based on three matrixes with different curing shrinkage, three electrical conductive adhesives were prepared. The effects of curing shrinkage of matrix in isothermal cure on the conductivity of electrical conductive adhesive were studied by some experiments. The results show that the volume resistivity of the electrical conductive adhesives is smaller when choosing the matrix with greater curing shrinkage. There is a power law dependence of the curing shrinkage of matrix upon the curing time. The conductive adhesives are nearly insulated before cured. As to conductive adhesives, the conductivity establishment is completed during the gelation stage, the conductivity drops sharply first and then changes slightly in the process of the conductivity establishment.
作者 李芝华 孙健
出处 《高分子材料科学与工程》 EI CAS CSCD 北大核心 2010年第8期80-82,86,共4页 Polymer Materials Science & Engineering
关键词 导电胶 固化收缩 导电机理 体积电阻率 electrical conductive adhesive curing shrinkage conductive mechanism volume resistivity
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参考文献10

  • 1JIANG H J, MOON K S, LU J X, et al. Conductivity enhancement of nanosilver-filled conductive adhesives by particle surface functionalization[ J ]. Journal of Electronic Materials, 2005, 34(11 ) : 1432-1439. 被引量:1
  • 2JIANG H J, MOON K S, LI Y, et al. Surface functionalized silver nanoparticles for ultrahigh conductive polymer composites [ J ]. Chem. Mater., 2006, 18(13): 2969-2973. 被引量:1
  • 3XU S Y, DAVID A D, JOHN G D .Environmental aging effects on the durability of electrically conductive adhesive joints [ J ]. International Journal of Adhesion and Adhesives, 2003, 23(3) : 235- 250. 被引量:1
  • 4TAN F, QIAO X L, CHEN J G, et al. Effects of ooupling agents on the properties of epoxy-based electrically conductive adhesives[J]. International Journal of Adhesion and Adhesives, 2006, 26 (6): 406- 413. 被引量:1
  • 5WU Z H, LI J Z, DOUGLAS T, et al. Study of processing variables on the electrical resistivity of conductive adhesives[J]. International Journal of Adhesion and Adhesives, 2009, 29 (5): 488-494. 被引量:1
  • 6LEE H H, CHOU K S, ZONG W S. Effect of nano-sized silver particles on the resistivity of polymeric conductive adhesives [ J ]. International Journal of Adhesion and Adhesives, 2005, 25 (5): 437-441. 被引量:1
  • 7KIM H K, SHI F G. Electrical reliability of electrically conductive adhesive joints: dependence on curing condition and current density [J]. Microelectronies Journal, 2001, 32(4): 315-321. 被引量:1
  • 8DONGS H, MOON K S, WONG C P. Molecular dynamics study of nanosilver partieles for low-temperature lead-free interconnect applications [J]. Journal of Electronic Materials, 2005, 34( 1 ): 40- 45. 被引量:1
  • 9YONG S E, KEONSOO J, JONG T M, et al. Electrical and mechanical characterization of an anisotropic conductive adhesive with a low melting point solder[J ]. Microelectronic Engineering, 2008, 85( 11 ) : 2202-2206. 被引量:1
  • 10KIM H K, SHI F G. Electrical reliability of electrically conductive adhesive joints: dependence on curing condition and current density [J]. Microelection Journal, 2001, 32(4): 315-321. 被引量:1

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