摘要
为实现硅片的非接触式夹持,减少生产过程中因夹持装置与硅片表面接触导致的产品缺陷,提出一种新的硅片夹持方法,该方法利用空气动力学原理,在半封闭的流道中诱发旋涡流,借助于旋涡中心的负压力、空气溢出的正压力和硅片自重三者之间的动态平衡,实现硅片的非接触夹持。首先对此悬浮原理进行理论分析,在理论分析的基础上设计出可实现夹持功能的双进气口真空吸盘,采用RNGk-ε湍流模型对吸盘内完全气体的正压旋转流场进行数值模拟,对吸盘吸附力进行试验研究。结果表明:利用旋涡式真空吸盘可以实现非接触式夹持过程,吸盘对硅片产生的吸附力大小与工作距离、进气压强和吸盘结构参数等密切相关。
A new levitation theory is introduced to achieve non-contact wafer handling,and eliminate the production defects that arise from the physical contact between the holder and wafer surface.This method,according to aero-dynamics,produces vortex flow in semi-closed flow passage,and then results in non-contact clamping in virtue of the dynamic balance among the negative pressure of vortex center,the positive pressure of air overflowng and the weight of wafer.The levitation theory is analyzed,and a prototype of vacuum cup with two nozzles is designed.Numericl simulation of the positive pressure rotary flow field of perfect gas in the cup is carried out by using the RNG k-ε turbulence model.Finally the adsorption force of the cup is tested.The test results indicate that the vortex vacuum cup is able to carry out non-contact clamping,and the adsorption force acting on the wafer is closely related to the working distance,inlet pressure,and structural parameters of the cup.
出处
《机械工程学报》
EI
CAS
CSCD
北大核心
2010年第16期189-194,共6页
Journal of Mechanical Engineering
基金
浙江省重大科技专项(2008C11069)
中央高校基本科研业务费专项资金资助项目
