摘要
在分析单晶硅片的典型加工工艺基础上,介绍了基于工件旋转式磨削法的大直径硅片超精密加工技术的原理及特点,综述了该项技术的试验研究进展及建立的数学模型,分析了有限元法在工件旋转式磨削硅片研究中的应用,最后提出了工件旋转式磨削大直径硅片技术目前存在的问题和今后的发展趋势。
Based on analysis of the typical processing technics for silicon wafers, the mechanism and characteristics of work-rotation grinding-based method are presented . The latest development in the experimental study of ultra-precision machining technology for large-scale silicon wafers based on work-rotation and the mathematical models are introduced. The application of the finite element method in this field is analyzed. Finally, the problems and development trends of this technique are pointed out.
出处
《宇航材料工艺》
CAS
CSCD
北大核心
2006年第5期21-26,共6页
Aerospace Materials & Technology
基金
江苏省自然科学基金前期预研资助项目(BK2005215)
关键词
大直径硅片
超精密加工
工件旋转式磨削
平整度
Large-Scale silicon wafers, Ultra-Precision machining, Work-Rotation grinding, Flatness
