摘要
应用有限元分析软件ANSYS研究了W/Cu功能梯度涂层的3D模型在不同热流密度的稳态冲击下的工作应力和分布以及在边缘局域模式下的瞬态热冲击的表面温度随热流持续时间的关系。结果表明,当钨涂层表面层厚度为2mm、梯度层为240μm时,最大等效应力得到有效缓解;W/Cu部件能承受高达500MW、持续时间为5ms的高热流冲击。
Distribution and magnitude of thermal stress of 3D W/Cu functional gradient materials under various steady high heat flux conditions are analyzed using commercial finite element analysis software ANSYS code. Relationship between the surface temperature and the time of high transient heat flux ELMqike（Edge localized model） events of this component is also modeled. The simulation results show that maximum Von Mises stress is effectively alleviated when the thickness of the functionally graded materials is 2mm, tungsten coating is 240μm, and the W/Cu component can withstand up to 500MW high transient heat flux with 5ms duration time without melting occurred.
出处
《材料导报》
EI
CAS
CSCD
北大核心
2010年第16期84-87,共4页
Materials Reports
基金
ITER973项目(2008CB717802)
关键词
W/Cu功能梯度涂层
面向等离子体材料
有限元分析
热应力
W/Cu functionally graded coatings, stress plasma facing materials, finite element analysis, thermal
