摘要
文章介绍了Sn、Sn-3.0Ag-0.5Cu(SAC)、Sn-0.7Cu(SC)、Sn-9Zn(SZ)、Sn-58Bi(SB)等五种无铅焊锡与金/镍/不锈钢(Au/Ni/SUS304)与铁-42wt%Ni(Alloy42)基材的界面反应。在不锈钢基材方面:与Sn反应仅生成Ni3Sn4相,与SAC反应初期生成Ni3Sn4相。随反应时间增长则生成(Cu,Ni)6Sn5相且剥离界面;另于界面处则有FeSn2相生成。与SC反应则生成层状(Cu,Ni)6Sn5相,随反应延长产生大规模剥离,并在界面生成FeSn2相。仅有Ni5Zn21相生成于SZ/Au//Ni/SUS304系统。SB/Au//Ni/SUS304系统也仅有Ni3Sn4相生成。在Alloy42基材方面:与纯Sn的界面反应仅生成FeSn2相。SAC焊锡与Alloy42基材反应生成(Fe,Ni,Cu)Sn2相,随反应时间延长该相形态变成连续及块状两层结构。在SC/Alloy42反应系统中仅观察到FeSn2相的生成。仅有(Ni,Fe)5Zn21层生成于SZ/Alloy42系统。与SC/Alloy42系统相似,与SB/Alloy42系统只有FeSn2相的生成,并无其他介金属相的生成。
The interfacial reactions in Sn,Sn-3.0Ag-0.5Cu（SAC）,Sn-0.7Cu（SC）,Sn-9Zn（SZ）,and Sn-58Bi （SB） lead-free solders with Au//Ni/SUS 304 and Fe-42wt%N（i Alloy 42） substrates are systemically reported in this article.In the Solder/Au//Ni/SUS 304 sections：Only the Ni3Sn4 phase was formed in the Sn/Au/Ni/SUS 304 system.In the SAC/Au/Ni/SUS 304 system,the Ni3Sn4 phase was formed at the initial stage;when the reaction time was increased,the（Cu,Ni）6Sn5 and FeSn2 phases were formed.Meanwhile,the massive spalling of the（Cu,Ni）6Sn5 phase can be observed.The （Cu,Ni）6Sn5 phase was formed in the SC/Au//Ni/SUS 304 systems;the massive spalling（Cu,Ni）6Sn5 phase and planar FeSn2 phase were formed,when the reaction time was increased.Only the Ni5Zn21 phase was formed in the SZ /Au//Ni/SUS 304 systems.The Ni3Sn4 was formed in the SB/Au/Ni/SUS 304 systems.In the Solder/Alloy 42 sections：Only the FeSn2 phase was formed in the Sn/Alloy 42,SC/Alloy 42 and SB/Alloy 42 systems.The layer structure of the（Fe,Ni,Cu）Sn2 between SAC solder and Alloy 42.substratewas formed.As increasing the reaction time,the Ni5Zn21 phase with distinct thickness can be observed.Only the one intermryallic compound （IMC）,the （Ni,Fe）5Zn21 phase was formed in the between SZ/Alloy 42 system.
出处
《电子与封装》
2010年第6期1-5,11,共6页
Electronics & Packaging
