摘要
从陶瓷基介质材料和微晶玻璃基介质材料两个方面进行综述,介绍了几种低温烧结介质基板材料的国内外研究进展,研究了低温烧结介质基板材料与内电极的异相匹配共烧的重要性,探讨了低温烧结介质基板材料主要存在的问题和发展趋势。
LTCC materials for the dielectric substrate can be divided into ceramic series and glass-ceramics series,and the development of several LTCC materials for dielectric substrate application at home and abroad is described.Based on those materials,the importance of perfect match co-firing between the LTCC materials and the inner electrode is investigated.Finally,the existing problems and development trends of these LTCC materials are discussed.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2010年第1期70-74,共5页
Electronic Components And Materials
关键词
无机非金属材料
低温烧结
综述
介质基板
匹配共烧
non-metallic inorganic materials
low temperature sintering
review
dielectric substrate
perfect match co-firing
