摘要
采用扫描电镜(SEM)、傅里叶变换红外光谱(FT-IR)、X射线光电子能谱(XPS)差示扫描量热法(DSC)等分析技术对3种聚醚环酰胺键合剂包覆HMX晶体后的性能进行了表征。实验表明,聚醚环酰胺类键合剂不仅对HMX具有良好的粘附性能,而且与HMX有较好的相容性,从而证实聚醚环酰胺类作为HMX键合剂的有效性。
The properties of coated HMX with bonding agent containing polyether of heterocycle amide was characterized by scanning electron microscope （SEM）, fourier transform infrared spectroscopy （ FT-IR）,X-ray photoelectron spectroscopy （XPS） and differential scanning calorimetry （DSC）. The results indicated that the bonding agents containing polyether of heterocyclic amide have better adhesion and also compatibility to HMX, therefore , that demonstrated the availability as the bonding agent for HMX.
出处
《粘接》
CAS
2010年第5期41-44,共4页
Adhesion
