摘要
非晶硅薄膜(a-Si)是目前重要的光敏材料,在很多领域得到广泛应用。直流磁控溅射具有工艺简单,沉积温度低等优点,是制备薄膜的一种重要技术。采用直流磁控溅射工艺在玻璃基板上沉积薄膜,并对样品进行了退火处理。研究了沉积速率与溅射功率的关系。结果表明薄膜的沉积速率与溅射功率近似有线性关系。利用X射线衍射(XRD)对薄膜进行了分析鉴定,结果表明溅射的薄膜是非晶硅薄膜。利用扫描电子显微镜(SEM)对非晶硅薄膜的表面形貌进行了观察和分析,与X射线衍射测试的结果一致。所以,利用直流磁控溅射工艺能在常温下能快速制备出良好的非晶硅薄膜。
The amorphous silicon thin film is an important light-sensitive material that has received significant attention and been used widely in a good deal of fields. DC Reactive Magnetron Sputtering technology is an important method in depositing thin films and has some advantages such as simple technology,low deposition temperature and so on. amorphous silicon thin films is deposited on glass substrates by DC reactive magnetron sputtering technology, and annealing is carried out for amorphous silicon thin films. The dependence of deposit rate on sputtering power and air pressure is researched. The result indicates that the relation between deposit rate and sputtering power is linear. The thin films is analyzed by X-ray diffraction （XRD）and the research show that the thin film is amorphous . The thin film＇s surface is observed by scan electronic microscope （SEM） and the result is accordant with X-ray Diffraction. So the amorphous silicon thin films could be deposited rapidly by DC reactive magnetron sputtering technology.
出处
《电子设计工程》
2010年第4期105-107,共3页
Electronic Design Engineering
关键词
直流磁控溅射
沉积速率
非晶硅薄膜
X射线衍射
扫描电子显微镜
DC reactive magnetron sputtering
deposit rate
amorphous silicon thin films
X-ray diffraction
scan electronic microscope
