摘要
随着IC制造工艺水平的提高,信号的上升沿越来越快,由此就会引发许多反射、串扰、过冲和下冲等信号不完整的问题。由于这些问题都是由IC芯片的边沿速率提升导致,因此统称它们为高速问题。分析了各种高速问题中反射、串扰、过冲和下冲等产生的原因机理,并总结出了在PCB设计过程中的解决方法。
With the development of IC produce technics level, the rise edge of signals become faster and faster. Then some high speed problems will occur, such as echo, crosstalk, over shoot, under shoot, and so on. In the paper, the theories of high speed problems are analyzed. The way which solves the high speed problems during PCB design is offered.
出处
《电子工艺技术》
2010年第2期90-92,120,共4页
Electronics Process Technology
关键词
高速电路
高速问题
反射
串扰
过冲
下冲
D ocum en t C ode:A A rticle ID:1001-3474(2010)02-0090-04
