摘要
本文运用ZSX仪器分析软件建立了基本参数法(FP)测试模型,对冷轧镀锡板Sn层质量分析中非测量层SnKα特征谱线对定量分析的影响进行了研究。阐述了影响非测量层SnKα特征谱线产生的两大因素基板厚度和镀层质量及其变化对定量分析产生的SnKα增量影响程度,得出当基板厚度大于0.2 mm时,非测量层SnKα特征谱线产生的增量较小,可以进行相应的校正;当基板厚度小于0.2 mm时,非测量层SnKα特征谱线产生的Sn增量较大,且不易校准;当基板厚度一定并可导致非测量SnKα特征谱线产生时,此时由镀层质量变化而导致非测量SnKα特征谱线产生的Sn增量比较稳定,可进行相应的校正,并用实际生产样品进行了分析、验证。
The fundamental parameter （FP） method test model was established using ZSX instrumental analysis software in this study. The effect of SnKo characteristic lines in non-measurement layer on quantitative analysis of Sn-layer mass in cold-rolled tin plate was investigated. The influence of both factors affecting SnKα characteristics lines in non-measurement layer, substrate thickness and coating mass, on the SnKα increment caused in quantitative analysis is analyzed. It was found that when the substrate thickness was more than 0.2 mm, the increment caused by SnKα characteristic lines in non- measurement layer was relatively little, and the corresponding correction could be conducted; When the substrate thickness was less than 0.2mm, the increment caused by SnKα characteristic lines in non-measurement layer was relatively large and hardly corrected; When the substrate thickness was definite, which would generate non-measurement SnKα characteristic lines, the Sn increment caused by change of plating mass was relatively stable, and the corresponding correction could be conducted. The results were analyzed and verified bv actual product samples.
出处
《冶金分析》
CAS
CSCD
北大核心
2010年第3期18-22,共5页
Metallurgical Analysis
关键词
X射线荧光光谱
基板厚度
镀层质量
非测量层
SnKα
X-ray fluorescence spectrometry
substrate thickness
plating quality
non-measurement layer
SnKα
