摘要
基于Kelvin模型粘弹性材料本构关系导出了阻尼层合板的动力学微分方程组,给出了四边简支阻尼层合板的固有频率和损耗因子的解析解。与文献结果比较表明,将Kelvin模型应用于粘弹结构的动力特性问题求解,计算模型简便,且计算结果比常复数模型更为精确。分析了阻尼层参数变化对结构振动特性的影响。分析结果表明:增加阻尼层厚度,可以有效提高结构损耗因子;增加阻尼层材料的剪切模量,结构损耗因子增大到一定值后又逐渐减小,在减振设计中阻尼层的模量存在最佳值。
Based on Kelvin model, a set of dynamical equations were derived for rectangular sandwich plates with a viscoelastic mid-layer, and the analytic solutions of natural frequencies and modal loss factors were presented under the simple support boundary condition. The comparison of the current results with those in the documents shows that applying Kelvin model to the dynamical analysis of viscoelastic structure is simple and more accurate than the constant complex model. The influences of viscoelastic layer parameters on the vibration behaviors of sandwich plates were analyzed. The analysis results show that the structure loss factors will increase significantly with the increase of thickness of the damping layer; the structure loss factors will increase to its maximum value and then decrease with the increase of the modulus of the damping layer, which shows that there shall be an optimal value about the modulus of the damping material for the vibration suppression.
出处
《海军工程大学学报》
CAS
北大核心
2010年第1期12-17,共6页
Journal of Naval University of Engineering
基金
国家自然科学基金资助项目(10572150)
关键词
粘弹性
阻尼层合板
开尔文模型
振动
viscoelasticity
damping sandwich plate
Kelvin model
vibration
