摘要
分析了阴极电流密度、微粒的质量浓度、温度、搅拌速率等对铜-钨复合镀层中钨微粒的体积分数的影响。用扫描电镜观察正交优化工艺制备的复合镀层,结果表明:镀层电沉积结晶均匀、细致。此外,对复合电沉积铜-钨的过程机理进行了初步探讨,结果表明:在低电流密度条件下,铜-钨复合镀层的沉积遵循Guglielmi模型机理。
The effects of cathode current density, mass concentration of suspended W powders, temperature, stirring intensity on the volume fraction of W particles in the Cu-W composite coating were studied. The results of SEM analysis show that the crystallization of the electrodeposited composite coating prepared with orthogonal optimized technology is homogeneous and compact. In addition, the mechanism of the composite electrodeposition was preliminary investigated. The results show that Guglielmi＇s model mechanism is followed at low current densities for the deposition of Cu W composite coating.
出处
《电镀与环保》
CAS
CSCD
北大核心
2010年第1期19-22,共4页
Electroplating & Pollution Control
基金
贵州省科技厅工业攻关项目Z083076[2008]3030
贵州大学青年基金项目X082030[2007]030
关键词
铜-钨复合镀层
电沉积
工艺
机理
Cu-W composite coating
electrodeposition
process
mechanism
